this is information on a product in full production. june 2012 doc id 023219 rev 1 1/10 10 EMIF02-SPK03F2 2-channel emi filter and esd protection for speaker phone datasheet ? production data features 2-channel emi symmetrical (i/o) low-pass filter high efficiency in emi filtering: ? s21 attenuation, -40 db at 900 mhz ? xtalk, in audio band, -60 db very low pcb space consumption: 0.89 x 1.26 mm very thin package: 0.6 mm after reflow high efficiency in esd suppression on input pins (iec 61000-4-2 level 4) high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging packaged in lead-free flip chip complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) application mobile phones portable devices connectivity devices description the EMIF02-SPK03F2 chip is a highly integrated device designed to suppress emi/rfi noise for interface line filtering. the EMIF02-SPK03F2 is 2-channel, ultra compact, high attenuation filter available in 0.5 mm pitch wlcsp package. additionally, this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up 30 kv. figure 1. pin configuration (bump side) figure 2. functional schematic flip chip (5 bumps) 3 o1 o2 gnd i2 i1 2 a b c 1 i1 o1 i2 o2 l l c c c c www.st.com
characteristics EMIF02-SPK03F2 2/10 doc id 023219 rev 1 1 characteristics figure 3. electrical char acteristics - definitions table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2 (1) air discharge contact discharge 1. measurements done on iec 61000-4-2 test bench. for further details see application note an3353, ?iec 61000-4-2 standard testing?. 30 kv i spk maximum rms currrent per channel 800 ma t j maximum junction temperature 125 c t op operating temperature range -30 to 85 c t stg storage temperature range -55 to + 150 c table 2. electrical characteristics - values (tamb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 v r d tp = 100 ns 0.2 i rm v rm = 3 v per line 0.3 a r dc_l dc resistance of the inductor 0.07 0.1 c line vline = 0 v, v osc = 30 mv, f = 1 mhz 250 pf symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = peak pulse current i = breakdown current r br rm rm rm pp r v = clamping voltage cl d = dynamic resistance i i pp pp v v cl cl slope: 1/r d slope: 1/r d
EMIF02-SPK03F2 characteristics doc id 023219 rev 1 3/10 figure 4. insertion losses versus frequency figure 5. analog crosstalk versus frequency 300k 1m 3m 10m 30m 100m 300m 1g 3g -60 -50 -40 -30 -20 -10 0 EMIF02-SPK03F2 aplac 8.21 user: f:cust# 8463:stmicroelectronics - tours:awr corporation:rp=111 s21 db f/hz i1-o1 i2-o2 300k 1m 3m 10m 30m 100m 300m 1g 3g -70 -60 -50 -40 -30 -20 -10 0 EMIF02-SPK03F2 aplac 8.21 user: f:cust# 8463:stmicroelectronics - tours:awr corporation:rp=111 xtalk db f/hz i1-o2
characteristics EMIF02-SPK03F2 4/10 doc id 023219 rev 1 figure 6. audio band analog crosstalk figure 7. clamping voltage v cl versus peak pulse current i pp for short pulse duration such as esd surges note: for further information on the dynamic characteristic see the stmicroelectronics? application note an4022, ?tvs short pulse r d measurement and correlation with tvs clamping voltage during esd?. i pp (a) 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 0 2 4 6 8 10 12 14 16 v cl (v) triangular pulse t p = 100 ns direct and reverse polarity t j initial = 25 c
EMIF02-SPK03F2 characteristics doc id 023219 rev 1 5/10 figure 8. esd test conditions figure 9. output filter esd response to iec 61000-4-2 (+30 kv contact discharge) ix to ox 2 x -20 db 50 input
characteristics EMIF02-SPK03F2 6/10 doc id 023219 rev 1 figure 10. output filter esd response to iec 61000-4-2 (-30 kv contact discharge) ix to ox figure 11. total harmonic distortion plus noise
EMIF02-SPK03F2 ordering information scheme doc id 023219 rev 1 7/10 2 ordering information scheme figure 12. ordering information scheme emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f = flip chip x = 2: lead-free, pitch = 500 m, bump = 255 m
package information EMIF02-SPK03F2 8/10 doc id 023219 rev 1 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. package dimensions figure 14. footprint figure 15. marking 0.89 mm 50 m 1.26 mm 50 m 435 m 315 m 50 500 m 10 250 m 10 650 m 65 500 m 15 copper pad diameter: 250 m recommended, 300 m max. solder stencil opening: 330 m recommended solder mask opening recommendation: 340 m min. for 315 m copper pad diameter x y x w z w dot, st logo ecopack status xx = marking z = manufacturing location yww = datecode (y = year ww = week)
EMIF02-SPK03F2 ordering information doc id 023219 rev 1 9/10 figure 16. tape and reel specification note: more information is availa ble in the application notes: an1235,?ipad? 400 m flip chip: package description and recommendations for use? an1751, ?emi filters: recommendations and measurements? 4 ordering information 5 revision history dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.73 0.05 1.02 0.22 1.39 st xxz yww st xxz yww st xxz yww table 3. ordering information order code marking package weight base qty delivery mode EMIF02-SPK03F2 jx flip chip 1.8 mg 5000 tape and reel 7? table 4. document revision history date revision changes 19-jun-2012 1 initial release.
EMIF02-SPK03F2 10/10 doc id 023219 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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